Category:IC packages

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Nederlands: Behuizingen van geïntegreerde schakelingen

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English: This category is for integrated circuit packages. Transistor packages can be found here and passive device packages (e.g. resistors) can be found here.

Nederlands: Deze categorie is voor ic-behuizingen. Transistorbehuizingen kunnen hier, en passieve componenten (bijv. weerstanden) kunnen hier worden gevonden.

semiconductor package

housing for a semiconductor part such as an IC or transistor

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Subclass of

Has part(s)

Different from

integrated circuit packaging

Authority file
Q17152858 GND ID: 4143472-9 Library of Congress authority ID: sh85084821 NL CR AUT ID: ph937585 J9U ID: 987007531509305171
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Subcategories

This category has the following 77 subcategories, out of 77 total.

B

Beam lead technology (5 F)
BGA integrated circuit packages (27 C, 74 F)

C

CBGA integrated circuit packages (1 F)
Ceramic integrated circuit packages (12 C, 76 F)
Chip-on-board (2 C, 129 F)
CLCC integrated circuit packages (2 C, 9 F)
CPGA integrated circuit packages (11 C, 23 F)
CQFP integrated circuit packages (3 C, 9 F)
CSP integrated circuit packages (8 C, 16 F)

D

Different integrated circuit packages (14 F)

E

EBGA integrated circuit packages (3 F)

F

FBGA integrated circuit packages (1 C, 58 F)
FCBGA integrated circuit packages (2 C, 7 F)
FCCSP integrated circuit packages (1 F)
FCFBGA integrated circuit packages (1 F)
Flatpack (21 F)
Flexiwatt integrated circuit packages (3 F)
Flip Chip (12 F)
FPBGA integrated circuit packages (3 F)

H

Heptawatt packages (1 F)
HTQFP integrated circuit packages (2 F)

L

LFCSP integrated circuit packages (2 C)
LGA integrated circuit packages (2 C, 40 F)
LLP integrated circuit packages (12 F)
LQFP integrated circuit packages (28 C, 55 F)

M

Metal can integrated circuit packages (5 C, 64 F)
MFP integrated circuit packages (1 F)
MICRO ARRAY integrated circuit packages (7 F)
MICRO SMD integrated circuit packages (18 F)
MLCC integrated circuit packages (1 F)
MLFP integrated circuit packages (1 F)
MLP integrated circuit packages (1 C, 3 F)
MO integrated circuit packages (1 C)
MQFP integrated circuit packages (11 F)
MSOP integrated circuit packages (17 F)
Multi-chip modules (4 C, 24 F)
Multi-leaded power packages (3 F)

P

PBGA integrated circuit packages (2 C, 4 F)
PDFN integrated circuit packages (1 F)
PGA integrated circuit packages (7 C, 29 F)
PLCC integrated circuit packages (14 C, 27 F)
PowerSO20 integrated circuit packages (1 F)
PQFP integrated circuit packages (6 C, 36 F)
PSOP integrated circuit packages (5 F)

Q

QFN integrated circuit packages (35 C, 141 F)
QFP integrated circuit packages (28 C, 55 F)
QSOP integrated circuit packages (1 C, 11 F)
Quad inline package (13 C, 40 F)

R

Red IC packages (60 F)

S

SIP integrated circuit packages (1 C, 42 F)
SOIC integrated circuit packages (20 C, 216 F)
SOJ integrated circuit packages (34 F)
SOP integrated circuit packages (16 C, 87 F)
SOT integrated circuit packages (9 C, 19 F)
SQFP integrated circuit packages (3 F)
SSOP integrated circuit packages (9 C, 44 F)

T

Tape Carrier Package (4 F)
TFBGA integrated circuit packages (2 C, 22 F)
TO integrated circuit packages (39 C, 2 F)
TQFP integrated circuit packages (19 C, 79 F)
TSOP integrated circuit packages (2 C, 5 F)
TSSOP integrated circuit packages (8 C, 141 F)

U

UFBGA integrated circuit packages (2 F)
UTQFN integrated circuit packages (1 F)

V

VFBGA integrated circuit packages (12 F)
VQFN integrated circuit packages (2 C, 13 F)

W

WBGA integrated circuit packages (4 F)
WCSP integrated circuit packages (2 C, 1 F)
WFBGA integrated circuit packages (2 F)
WLBGA integrated circuit packages (4 F)
WLNSP integrated circuit packages (1 F)
WQFN integrated circuit packages (7 F)
WSON integrated circuit packages (4 F)

Z

Zig-zag in-line package (16 F)

Media in category "IC packages"

This category contains only the following file.

XC6206 Package.jpg 2,522 × 2,522; 662 KB

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